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How can industrial computer motherboards improve reliability in industrial environments through redundant design?

How can industrial computer motherboards improve reliability in industrial environments through redundant design?

2025-10-15

Industrial motherboards often use a dual-fan cooling system. When the main fan fails, the backup fan automatically speeds up to maintain the PCB board temperature within a safe range.

How does the AI ​​computing module balance performance and energy consumption in low-power scenarios?

How does the AI ​​computing module balance performance and energy consumption in low-power scenarios?

2025-10-11

Through intelligent scheduling algorithms, the module can dynamically allocate computing resources based on task priority and real-time load.

How does the expansion slot layout of an industrial computer motherboard affect multi-sensor access?

How does the expansion slot layout of an industrial computer motherboard affect multi-sensor access?

2025-10-10

The electromagnetic compatibility (EMC) design of the expansion slot plays a key role in the multi-sensor signal integrity.

How can industrial computer motherboards easily adapt to diverse industrial scenarios?

How can industrial computer motherboards easily adapt to diverse industrial scenarios?

2025-10-02

As the core of industrial automation systems, industrial computer motherboards undertake critical tasks such as data processing, equipment control, and system integration.

How do smart retail business panels achieve unified management of multiple terminals?

How do smart retail business panels achieve unified management of multiple terminals?

2025-10-01

Smart retail business panels leverage advanced system architecture and cloud-based collaboration mechanisms to achieve unified management of multiple terminals, building an efficient.

How does the heat dissipation design of the AI ​​computing module cope with heat accumulation under high-density computing power?

How does the heat dissipation design of the AI ​​computing module cope with heat accumulation under high-density computing power?

2025-09-25

In AI computing modules, the tiny gap between the chip and the heat sink will cause a surge in thermal resistance due to the presence of air.

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