In AI computing modules, the tiny gap between the chip and the heat sink will cause a surge in thermal resistance due to the presence of air.
In AI computing modules, the tiny gap between the chip and the heat sink will cause a surge in thermal resistance due to the presence of air.
From design concept to implementation path, the anti-electromagnetic interference design of industrial computer motherboards always revolves around "redundancy and fault tolerance."
During the rapid deployment of AI technologies, a persistent challenge for development teams is that models trained well in a lab environment often perform poorly in production systems.
In the increasingly compact space of consumer laptops, the motherboard plays a crucial role in efficiently and stably delivering power to the core components, with the power supply module being the heart of this power management system.
In applications such as industrial automation, smart manufacturing, and remote monitoring, industrial computer motherboards are often deployed in locations far from ideal operating environments.
With the rapid development of smart retail, business panels are no longer simply information displays; they have evolved into intelligent interactive hubs connecting consumers, products, and operational systems.